BGA components have become ubiquitous in today’s electronic devices, thanks to the ever-increasing integration level of chips. As technology progresses, we now operate on a 5nm technological process, with single integrated transistors 4000 times smaller than those in the 1970s. This evolution has led to the adoption of BGA-type housings (Ball Grid Array), allowing for a compact placement of a large number of pins beneath the chip body.
Challenges of Micro Miniaturization: While the advantages of micro miniaturization are evident, repairing or soldering elements within BGA-type housings presents certain challenges. Soldering requires specialized equipment, skills, technological knowledge, and professionalism, given the intricacies involved in handling multiple contact legs and pads beneath a digital controller or a small chip.
Soldering BGA Chips – Technology:
Dismantling a faulty microelement after preheating.
Cleaning the carrier board from remnants of old solder.
Rolling new contact leads.
Installing the component in place.
Quality and Professionalism: The quality of soldering significantly depends on the technician’s professionalism and skills. BGA soldering demands experience, knowledge of the element base, keen eyesight, and high-quality consumables. Having a professional IR station facilitates high quality repairs.
Tools and Materials Needed: To work with BGA chips, you’ll need:
Soldering station IR
Convenient tweezers
Special solder paste and proprietary flux or certain size solder balls
Required stencil for applying solder paste
Adhesive tape or braid for removing solder
Soldering Procedure:
For high-quality soldering, preliminary preparation of the working area is crucial. The board to be repaired is placed on a horizontal platform with bottom heating using a local infrared emitter. The emitter prevents board distortion, while the upper IR emitter heats the chip. The temperature is monitored to avoid exceeding 200°C, facilitating element dismantling.
Key Steps:
Preheat the board and chip.
Use a chip “lift” to separate the chip from the board.
Clean the board and chip from remaining solder.
Roll new contact pins onto the chip using specialized stencils.
Install the chip in place, guided by silk-screen printing or mounting marks.
Heat the microcircuit with IR, fixing it in the initial dismantling site.
Final Step:
Completing the repair procedures involves washing the board with flux-off aerosol and testing for functionality. With the right tools, knowledge, and careful execution, soldering BGA components ensures a successful restoration of electronic devices. VOILA!
Trust Flexa Systems – Your Reliable Partner in PLC and Industrial PC Solutions
At Flexa Systems, we understand that dealing with PLC or Industrial PC issues can be a daunting task. That’s where we come in as your trusted partner, ready to take the stress off your shoulders. When you choose Flexa Systems, you’re choosing a team of dedicated professionals committed to providing top-notch solutions for your PLC and Industrial PC needs.
Expertise You Can Rely On:
Our seasoned technicians bring a wealth of experience to the table, with a combined track record of over 14 years in handling intricate tasks, including BGA Chip Replacement and Regaling. You can trust that your PLC or Industrial PC is in capable hands – we’ve seen it all and fixed it all.
Customer-Centric Approach:
Your satisfaction is our priority. We take a customer-centric approach, focusing on clear communication and understanding your unique requirements. When you trust Flexa Systems, you’re not just getting a service; you’re getting a partner dedicated to your success.
Reliability Redefined:
Flexa Systems is more than a service provider – we’re a reliable ally in your journey to resolving PLC and Industrial PC issues. Trust us to deliver results that exceed your expectations, providing you with the peace of mind you deserve.
Choose Flexa Systems – where expertise meets reliability, and your PLC or Industrial PC concerns find their perfect solution.
BGA Chip replacement
BGA components have become ubiquitous in today’s electronic devices, thanks to the ever-increasing integration level of chips. As technology progresses, we now operate on a 5nm technological process, with single integrated transistors 4000 times smaller than those in the 1970s. This evolution has led to the adoption of BGA-type housings (Ball Grid Array), allowing for a compact placement of a large number of pins beneath the chip body.
Challenges of Micro Miniaturization: While the advantages of micro miniaturization are evident, repairing or soldering elements within BGA-type housings presents certain challenges. Soldering requires specialized equipment, skills, technological knowledge, and professionalism, given the intricacies involved in handling multiple contact legs and pads beneath a digital controller or a small chip.
Soldering BGA Chips – Technology:
Quality and Professionalism: The quality of soldering significantly depends on the technician’s professionalism and skills. BGA soldering demands experience, knowledge of the element base, keen eyesight, and high-quality consumables. Having a professional IR station facilitates high quality repairs.
Tools and Materials Needed: To work with BGA chips, you’ll need:
Soldering Procedure:
For high-quality soldering, preliminary preparation of the working area is crucial. The board to be repaired is placed on a horizontal platform with bottom heating using a local infrared emitter. The emitter prevents board distortion, while the upper IR emitter heats the chip. The temperature is monitored to avoid exceeding 200°C, facilitating element dismantling.
Key Steps:
Preheat the board and chip.
Use a chip “lift” to separate the chip from the board.
Clean the board and chip from remaining solder.
Roll new contact pins onto the chip using specialized stencils.
Install the chip in place, guided by silk-screen printing or mounting marks.
Heat the microcircuit with IR, fixing it in the initial dismantling site.
Final Step:
Completing the repair procedures involves washing the board with flux-off aerosol and testing for functionality. With the right tools, knowledge, and careful execution, soldering BGA components ensures a successful restoration of electronic devices. VOILA!
Trust Flexa Systems – Your Reliable Partner in PLC and Industrial PC Solutions
At Flexa Systems, we understand that dealing with PLC or Industrial PC issues can be a daunting task. That’s where we come in as your trusted partner, ready to take the stress off your shoulders. When you choose Flexa Systems, you’re choosing a team of dedicated professionals committed to providing top-notch solutions for your PLC and Industrial PC needs.
Expertise You Can Rely On:
Our seasoned technicians bring a wealth of experience to the table, with a combined track record of over 14 years in handling intricate tasks, including BGA Chip Replacement and Regaling. You can trust that your PLC or Industrial PC is in capable hands – we’ve seen it all and fixed it all.
Customer-Centric Approach:
Your satisfaction is our priority. We take a customer-centric approach, focusing on clear communication and understanding your unique requirements. When you trust Flexa Systems, you’re not just getting a service; you’re getting a partner dedicated to your success.
Reliability Redefined:
Flexa Systems is more than a service provider – we’re a reliable ally in your journey to resolving PLC and Industrial PC issues. Trust us to deliver results that exceed your expectations, providing you with the peace of mind you deserve.
Choose Flexa Systems – where expertise meets reliability, and your PLC or Industrial PC concerns find their perfect solution.